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Flexible Substrates

The Business Unit Packaging Technology has extensive experience and expertise in the field of materials technology. The production of sophisticated flexible substrates in mass production is one of the key competences of the Business Unit. This technology enables the cost-effective production of connection methods and substrates for the solar and photovoltaic industry. To meet customer requirements the following technologies are available:
  • Stamping of flexible substrates
  • Laminating of PEN, PET, polyimide, epoxy and many others
  • Plating of gold, nickel, silver, palladium, tin and others
  • Etch technologies
  • Flexible Cu-alloy substrates from 60 μm to 100 μm
  • Surface refinement to generate bonding areas, contact and soldering areas
  • Multilayer structured laminates to meet the requirements of the electronics industry such as bonding, temperature stress and wettability
Flexible substrates